55 lines
3.4 KiB
Plaintext
Executable File
55 lines
3.4 KiB
Plaintext
Executable File
(module ST_WLCSP-20_1.94x2.40mm_Layout4x5_P0.4mm (layer F.Cu) (tedit 639F07E2)
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(descr "ST WLCSP-20, ST die ID 456, 1.94x2.4mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g051f8.pdf#page=102")
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(tags "CSP 20 0.4")
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(attr smd)
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(solder_mask_margin 0.0325)
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(solder_paste_margin 0.0125)
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(fp_text reference REF** (at 0 -2.2) (layer F.SilkS)
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(fp_text value ST_WLCSP-20_1.94x2.40mm_Layout4x5_P0.4mm (at 0 2.2) (layer F.Fab)
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(fp_line (start 0.97 1.2) (end -0.97 1.2) (layer F.Fab) (width 0.1))
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(fp_line (start -0.97 1.2) (end -0.97 -0.715) (layer F.Fab) (width 0.1))
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(fp_line (start -0.97 -0.715) (end -0.485 -1.2) (layer F.Fab) (width 0.1))
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(fp_line (start -0.485 -1.2) (end 0.97 -1.2) (layer F.Fab) (width 0.1))
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(fp_line (start 0.97 -1.2) (end 0.97 1.2) (layer F.Fab) (width 0.1))
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(fp_line (start -1.97 -2.21) (end -1.97 2.21) (layer F.CrtYd) (width 0.05))
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(fp_line (start -1.97 2.21) (end 1.97 2.21) (layer F.CrtYd) (width 0.05))
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(fp_line (start 1.97 2.21) (end 1.97 -2.21) (layer F.CrtYd) (width 0.05))
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(fp_line (start 1.97 -2.21) (end -1.97 -2.21) (layer F.CrtYd) (width 0.05))
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(fp_line (start -0.595 -1.31) (end 1.08 -1.31) (layer F.SilkS) (width 0.12))
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(fp_line (start 1.08 -1.31) (end 1.08 1.31) (layer F.SilkS) (width 0.12))
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(fp_line (start 1.08 1.31) (end -1.08 1.31) (layer F.SilkS) (width 0.12))
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(fp_line (start -1.08 1.31) (end -1.08 -0.825) (layer F.SilkS) (width 0.12))
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(pad A1 smd circle (at -0.6 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste))
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(pad A2 smd circle (at -0.2 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste))
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(pad A3 smd circle (at 0.2 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste))
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(pad A4 smd circle (at 0.6 -0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste))
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(pad B1 smd circle (at -0.6 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste))
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(pad B2 smd circle (at -0.2 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste))
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(pad B3 smd circle (at 0.2 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste))
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(pad B4 smd circle (at 0.6 -0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste))
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(pad C1 smd circle (at -0.6 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste))
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(pad C2 smd circle (at -0.2 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste))
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(pad C3 smd circle (at 0.2 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste))
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(pad C4 smd circle (at 0.6 0) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste))
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(pad D1 smd circle (at -0.6 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste))
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(pad D2 smd circle (at -0.2 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste))
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(pad D3 smd circle (at 0.2 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste))
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(pad D4 smd circle (at 0.6 0.4) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste))
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(pad E1 smd circle (at -0.6 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste))
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(pad E2 smd circle (at -0.2 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste))
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(pad E3 smd circle (at 0.2 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste))
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(pad E4 smd circle (at 0.6 0.8) (size 0.225 0.225) (layers F.Cu F.Mask F.Paste))
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(fp_text user ${REFERENCE} (at 0 0 -90) (layer F.Fab)
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(effects (font (size 0.56 0.56) (thickness 0.084)))
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)
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(model Package_CSP.3dshapes/ST_WLCSP-20_1.94x2.40mm_Layout4x5_P0.4mm.wrl
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(at (xyz 0 0 0))
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(scale (xyz 1 1 1))
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(rotate (xyz 0 0 0))
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)
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)
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