kicad-libraries/footprints/Package_CSP.pretty/Nexperia_WLCSP-15_2.37x1.17mm_Layout6x3_P0.4mmP0.8mm.kicad_mod

(footprint "Nexperia_WLCSP-15_2.37x1.17mm_Layout6x3_P0.4mmP0.8mm"
	(version 20241229)
	(generator "kicad-footprint-generator")
	(layer "F.Cu")
	(descr "Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, generated with kicad-footprint-generator ipc_bga_generator.py, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf")
	(tags "CSP 15 0.4")
	(solder_mask_margin 0.0375)
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	(property "Value" "Nexperia_WLCSP-15_2.37x1.17mm_Layout6x3_P0.4mmP0.8mm"
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		(stroke
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		(stroke
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	(fp_text user "${REFERENCE}"
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	(pad "A1" smd circle
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		(property pad_prop_bga)
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		(property pad_prop_bga)
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	(pad "B1" smd circle
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	(pad "C2" smd circle
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		(size 0.25 0.25)
		(property pad_prop_bga)
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	(pad "C3" smd circle
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		(property pad_prop_bga)
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	(pad "C4" smd circle
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		(size 0.25 0.25)
		(property pad_prop_bga)
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	(pad "C5" smd circle
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		(size 0.25 0.25)
		(property pad_prop_bga)
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	(pad "C6" smd circle
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		(size 0.25 0.25)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Mask" "F.Paste")
	)
	(embedded_fonts no)
	(model "${USER_LIB}/3dmodels/Package_CSP.3dshapes/Nexperia_WLCSP-15_2.37x1.17mm_Layout6x3_P0.4mmP0.8mm.step"
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			(xyz 0 0 0)
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		(scale
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		(rotate
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)