Files
kicad-libraries/footprints/RF_Module.pretty/Taiyo-Yuden_EYSGJNZWY.kicad_mod
2025-08-28 03:07:33 +07:00

115 lines
8.1 KiB
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Executable File

(footprint "Taiyo-Yuden_EYSGJNZWY" (version 20211014) (generator pcbnew)
(layer "F.Cu")
(tedit 61D8B239)
(descr "Taiyo Yuden NRF51822 Module Bluetooth https://www.yuden.co.jp/wireless_module/document/datareport2/en/TY_BLE_EYSGJNZ_DataReport_V1_9_20180530E.pdf")
(tags "Taiyo Yuden NRF51822 Module Bluetooth ")
(attr smd)
(fp_text reference "REF**" (at 0 -6.7) (layer "F.SilkS")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 1593d42e-b3a3-49f1-a5f7-eb4716aa7fed)
)
(fp_text value "Taiyo-Yuden_EYSGJNZWY" (at 0 6.7 180) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 320d7224-02e8-4190-ae05-09f257d89d56)
)
(fp_text user "KEEP OUT ZONE" (at 0 4.25) (layer "Cmts.User")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp e1ead636-ad1b-4027-8ceb-87a17c79977c)
)
(fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 629a2994-1db2-4a7c-9bf5-5e176080abfe)
)
(fp_line (start -2.66 5.76) (end 2.66 5.76) (layer "F.SilkS") (width 0.12) (tstamp 07b2b5b5-16ef-4fbc-adf1-4fc44d27f5f8))
(fp_line (start -2.82 -5.92) (end -2.82 -4.92) (layer "F.SilkS") (width 0.12) (tstamp 487ee449-0259-48b0-a107-c27238f2ae9d))
(fp_line (start -2.66 -5.76) (end 2.66 -5.76) (layer "F.SilkS") (width 0.12) (tstamp 78116e29-ff6a-4ee5-816e-c4e00b6b5924))
(fp_line (start -2.66 -5.76) (end -2.66 5.76) (layer "F.SilkS") (width 0.12) (tstamp ca5fb4a6-949e-4c11-8dc0-18e5e3809d3f))
(fp_line (start -2.82 -5.92) (end -1.82 -5.92) (layer "F.SilkS") (width 0.12) (tstamp d9cfcb1f-c683-4458-a5b6-70f113a88a4a))
(fp_line (start 2.66 -5.76) (end 2.66 5.76) (layer "F.SilkS") (width 0.12) (tstamp da72081e-9bf9-4046-89ca-be3aacd134dc))
(fp_line (start -2.8 -5.9) (end -2.8 5.9) (layer "F.CrtYd") (width 0.05) (tstamp 73cd8d99-2aa8-4ffe-a955-4fd0be5a2d5f))
(fp_line (start 2.8 -5.9) (end 2.8 5.9) (layer "F.CrtYd") (width 0.05) (tstamp a14c1f85-9146-4f86-a1e2-e2f41e7c2f39))
(fp_line (start -2.8 5.9) (end 2.8 5.9) (layer "F.CrtYd") (width 0.05) (tstamp d84ce21a-232c-492f-bfd1-77eb9778bdc0))
(fp_line (start 2.8 -5.9) (end -2.8 -5.9) (layer "F.CrtYd") (width 0.05) (tstamp dec13c8f-3453-4076-ad13-70b39b620681))
(fp_line (start -1.55 -5.65) (end 2.55 -5.65) (layer "F.Fab") (width 0.1) (tstamp 2a39e3b8-e8f9-45d1-8650-9c7c1be1d9b0))
(fp_line (start -2.55 5.65) (end -2.55 -4.65) (layer "F.Fab") (width 0.1) (tstamp 7b47994c-8cf2-41e7-ac36-fb46148b9eef))
(fp_line (start -2.55 5.65) (end 2.55 5.65) (layer "F.Fab") (width 0.1) (tstamp 7dfb1b9b-c5a8-45c6-99f5-f054127a7adc))
(fp_line (start -1.55 -5.65) (end -2.55 -4.65) (layer "F.Fab") (width 0.1) (tstamp 82e3c43a-94cb-4504-a4a5-ade2c2de9475))
(fp_line (start 2.55 -5.65) (end 2.55 5.65) (layer "F.Fab") (width 0.1) (tstamp a6781371-b604-420c-9a29-e6803f5fc0ac))
(pad "" smd rect (at 0 -0.5) (size 1.2 1.1) (layers "F.Paste") (tstamp 30da420e-e4f7-4372-8207-70a4a5fb486f))
(pad "" smd rect (at 0 -2) (size 1.2 1.1) (layers "F.Paste") (tstamp 3df3dc2c-bce1-4942-84b0-3228f9e29c97))
(pad "1" smd rect (at -2.075 -5.05) (size 0.55 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin -0.035) (tstamp f3a38419-f360-4766-a045-4da48eb9618d))
(pad "2" smd rect (at -1.95 -4.05) (size 0.8 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin -0.03) (tstamp 002ee637-164d-4955-a850-762d53fbac79))
(pad "3" smd rect (at -1.95 -3.25) (size 0.8 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin -0.03) (tstamp 67e659cc-d967-4099-ad82-ba7d77f15775))
(pad "4" smd rect (at -1.95 -2.45) (size 0.8 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin -0.03) (tstamp 77199c23-483b-48b6-8f34-29390daaed99))
(pad "5" smd rect (at -1.95 -1.65) (size 0.8 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin -0.03) (tstamp 838cc3b0-1048-4bb2-b252-b3974c8ef96c))
(pad "6" smd rect (at -1.95 -0.85) (size 0.8 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin -0.03) (tstamp 9e828359-3a0f-48ba-9001-fdbeb4b48428))
(pad "7" smd rect (at -1.95 -0.05) (size 0.8 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin -0.03) (tstamp d615b74f-afff-4df2-a831-045751c84347))
(pad "8" smd rect (at -1.95 0.75) (size 0.8 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin -0.03) (tstamp 44a39431-1f8a-46a0-bf6b-712b4fdcd510))
(pad "9" smd rect (at -1.95 1.625) (size 0.8 0.55) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin -0.035) (tstamp 30de4557-422c-4fa1-9589-4ec75ee96c97))
(pad "10" smd rect (at -0.4 1.35) (size 0.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin -0.03) (tstamp 3777f351-32fd-4bb5-b7ad-da4205edab70))
(pad "11" smd rect (at 0.4 1.35) (size 0.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin -0.03) (tstamp 1942401c-bde2-4c27-bce0-b2d7a379006b))
(pad "12" smd rect (at 1.95 1.625) (size 0.8 0.55) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin -0.035) (tstamp 23f92d5e-9903-4d95-b1cf-13bb0d76908e))
(pad "13" smd rect (at 1.95 0.75) (size 0.8 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin -0.03) (tstamp 30187c99-c9e4-465f-8167-5a363f478836))
(pad "14" smd rect (at 1.95 -0.05) (size 0.8 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin -0.03) (tstamp 644a1379-5446-45d4-a0dc-c18b9113adfa))
(pad "15" smd rect (at 1.95 -0.85) (size 0.8 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin -0.03) (tstamp 18698de8-ba74-42e0-92df-792ffc30b660))
(pad "16" smd rect (at 1.95 -1.65) (size 0.8 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin -0.03) (tstamp 8c03382b-22ff-41f5-a963-50aab3ed6105))
(pad "17" smd rect (at 1.95 -2.45) (size 0.8 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin -0.03) (tstamp e00779ac-754f-4d16-8f16-57ad6eed13c8))
(pad "18" smd rect (at 1.95 -3.25) (size 0.8 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin -0.03) (tstamp 10afdca8-7e30-4417-8094-801fe424c0f6))
(pad "19" smd rect (at 1.95 -4.05) (size 0.8 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin -0.03) (tstamp 8d20716a-5f35-4c8a-8450-6f0604b2c60e))
(pad "20" smd rect (at 2.075 -5.05) (size 0.55 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin -0.035) (tstamp 81a9887a-806e-4b74-93a8-90aae4032ff4))
(pad "21" smd rect (at 1.2 -5.05) (size 0.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin -0.03) (tstamp aa9e24ef-428e-4f43-8fc8-245a57eb1c65))
(pad "22" smd rect (at 0.4 -5.05) (size 0.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin -0.03) (tstamp f2bdedc2-f4e4-4eb0-ba3e-b1bcdcb2829b))
(pad "23" smd rect (at -0.4 -5.05) (size 0.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin -0.03) (tstamp 4cbacc22-0d55-4532-8268-6625de003eed))
(pad "24" smd rect (at -1.2 -5.05) (size 0.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin -0.03) (tstamp 4a6715d8-793f-438e-9236-d74db53cb550))
(pad "25" smd rect (at 0.8 -3.85) (size 0.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin -0.03) (tstamp 855d3309-1117-4c7c-bd7d-d13fecbc9f11))
(pad "26" smd rect (at 0 -3.85) (size 0.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin -0.03) (tstamp ee7e53c0-a21f-4ae6-8cac-5cfa7349c59f))
(pad "27" smd rect (at -0.8 -3.85) (size 0.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin -0.03) (tstamp cb514429-3dad-447d-8e06-a3ee4a54a5d2))
(pad "28" smd rect (at 0 -1.25) (size 1.5 2.8) (layers "F.Cu" "F.Mask") (tstamp b8cbde2f-61a3-4260-82d7-be08a7696db7))
(zone (net 0) (net_name "") (layers *.Cu) (tstamp 0a8c9f43-999a-4128-95b1-bda8380acfa6) (hatch full 0.508)
(connect_pads (clearance 0))
(min_thickness 0.254)
(keepout (tracks not_allowed) (vias not_allowed) (pads not_allowed ) (copperpour not_allowed) (footprints not_allowed))
(fill (thermal_gap 0.508) (thermal_bridge_width 0.508))
(polygon
(pts
(xy -7.55 2.9)
(xy 7.55 2.9)
(xy 7.55 5.65)
(xy -7.55 5.65)
)
)
)
(model "${USER_LIB}/3dmodels/RF_Module.3dshapes/Taiyo-Yuden_EYSGJNZWY.wrl"
(offset (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)