(footprint "ST_WLCSP-20_1.94x2.4mm_Layout4x5_P0.4mm"
	(version 20241229)
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	(layer "F.Cu")
	(descr "ST WLCSP-20, ST die ID 456, 1.94x2.4mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, generated with kicad-footprint-generator ipc_bga_generator.py, https://www.st.com/resource/en/datasheet/stm32g051f8.pdf#page=102")
	(tags "CSP 20 0.4")
	(solder_mask_margin 0.0325)
	(solder_paste_margin 0.0125)
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	(pad "D3" smd circle
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		(size 0.225 0.225)
		(property pad_prop_bga)
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	)
	(pad "D4" smd circle
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		(size 0.225 0.225)
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	(pad "E2" smd circle
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		(size 0.225 0.225)
		(property pad_prop_bga)
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	(pad "E3" smd circle
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	(pad "E4" smd circle
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		(size 0.225 0.225)
		(property pad_prop_bga)
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	(embedded_fonts no)
	(model "${USER_LIB}/3dmodels/Package_CSP.3dshapes/ST_WLCSP-20_1.94x2.4mm_Layout4x5_P0.4mm.step"
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)