(footprint "Texas_DSBGA-28_1.9x3mm_Layout4x7_P0.4mm"
	(version 20241229)
	(generator "kicad-footprint-generator")
	(layer "F.Cu")
	(descr "Texas Instruments, DSBGA, area grid, 1.9x3.0mm, 28 Ball, 4x7 Layout, 0.4mm Pitch, generated with kicad-footprint-generator ipc_bga_generator.py, http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf")
	(tags "BGA 28 0.4 TI 28-ball YFP R-XBGA-N28")
	(solder_mask_margin 0.05)
	(property "Reference" "REF**"
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	(pad "D3" smd circle
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	(pad "D4" smd circle
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		(property pad_prop_bga)
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	(pad "E1" smd circle
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		(size 0.225 0.225)
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		(size 0.225 0.225)
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	(pad "G2" smd circle
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		(size 0.225 0.225)
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	(pad "G4" smd circle
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		(property pad_prop_bga)
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	(embedded_fonts no)
	(model "${USER_LIB}/3dmodels/Package_BGA.3dshapes/Texas_DSBGA-28_1.9x3mm_Layout4x7_P0.4mm.step"
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)