(footprint "NXP_VFBGA-42_2.6x3mm_Layout6x7_P0.4mm"
	(version 20241229)
	(generator "kicad-footprint-generator")
	(layer "F.Cu")
	(descr "NXP VFBGA-42, 2.6x3.0mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, generated with kicad-footprint-generator ipc_bga_generator.py, https://www.nxp.com/docs/en/package-information/SOT1963-1.pdf")
	(tags "BGA 42 0.4")
	(solder_mask_margin 0.04)
	(solder_paste_margin 0.0175)
	(property "Reference" "REF**"
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		(layer "F.SilkS")
		(effects
			(font
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				(thickness 0.15)
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	(property "Value" "NXP_VFBGA-42_2.6x3mm_Layout6x7_P0.4mm"
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		(layer "F.Fab")
		(effects
			(font
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				(thickness 0.15)
			)
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	(attr smd)
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		(fill yes)
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		(stroke
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	)
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	(pad "A5" smd circle
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	(pad "B1" smd circle
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	(pad "B6" smd circle
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	(pad "C1" smd circle
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	(pad "C2" smd circle
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	(pad "C3" smd circle
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	(pad "C4" smd circle
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		(size 0.24 0.24)
		(property pad_prop_bga)
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	)
	(pad "C5" smd circle
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		(size 0.24 0.24)
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	)
	(pad "D1" smd circle
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		(size 0.24 0.24)
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	)
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		(size 0.24 0.24)
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	(pad "F5" smd circle
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		(size 0.24 0.24)
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	)
	(pad "F6" smd circle
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		(size 0.24 0.24)
		(property pad_prop_bga)
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	)
	(pad "G1" smd circle
		(at -1 1.2)
		(size 0.24 0.24)
		(property pad_prop_bga)
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	)
	(pad "G2" smd circle
		(at -0.6 1.2)
		(size 0.24 0.24)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Mask" "F.Paste")
	)
	(pad "G3" smd circle
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		(size 0.24 0.24)
		(property pad_prop_bga)
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	)
	(pad "G4" smd circle
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		(size 0.24 0.24)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Mask" "F.Paste")
	)
	(pad "G5" smd circle
		(at 0.6 1.2)
		(size 0.24 0.24)
		(property pad_prop_bga)
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	)
	(pad "G6" smd circle
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		(size 0.24 0.24)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Mask" "F.Paste")
	)
	(embedded_fonts no)
	(model "${USER_LIB}/3dmodels/Package_BGA.3dshapes/NXP_VFBGA-42_2.6x3mm_Layout6x7_P0.4mm.step"
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			(xyz 0 0 0)
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		(scale
			(xyz 1 1 1)
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		(rotate
			(xyz 0 0 0)
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)